RO4350B 2-Layer 16.6mil ENEPIG PCB for High-Frequency RF Applications
1.Introduction
Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/glass. RO4350B laminates provide tight control on dielectric constant (Dk) and maintain low loss while utilizing the same processing method as standard epoxy/glass. Available at a fraction of the cost of conventional microwave laminates, RO4350B laminates do not require the special through-hole treatments or handling procedures as PTFE based materials. These materials are UL 94 V-0 rated for active devices and high power RF designs.
RO4350B material's thermal coefficient of expansion (CTE) provides several key benefits to the circuit designer. The expansion coefficient of RO4350B material is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4350B laminates provides reliable plated through-hole quality, even in severe thermal shock applications. RO4350B material has a Tg of >280°C (536°F) so its expansion characteristics remain stable over the entire range of circuit processing temperatures.
2.Key Features
Dielectric Constant (Dk): 3.48 ±0.05 @ 10 GHz/23°C
Factor: 0.0037 @ 10 GHz/23°C
Thermal Conductivity: 0.69 W/m/°K
CTE: X: 10 ppm/°C, Y: 12 ppm/°C, Z: 32 ppm/°C
Tg: >280°C
Moisture Absorption: 0.06%
Flammability Rating: UL 94 V-0
Surface Finish: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Board Thickness: 0.5mm (16.6mil core)
3.Benefits
Ideal for multi-layer board (MLB) constructions
Processes like FR-4 at lower fabrication costs
Excellent dimensional stability
Competitively priced
Suitable for active devices and high power RF designs
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RO4350B |
| Layer Count | Double sided (2-layer) |
| Board Dimensions | 42.3mm × 30.8mm (±0.15mm) |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.3mm |
| Via Type | Through-hole only (No blind vias) |
| Finished Board Thickness | 0.5mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 - 35 μm
Rogers RO4350B Core - 0.422 mm (16.6mil)
Copper layer 2 - 35 μm
6.PCB Statistics:
Components: 3
Total Pads: 10
Thru Hole Pads: 6
Top SMT Pads: 4
Bottom SMT Pads: 0
Vias: 5
Nets: 2
7.Typical Applications
Cellular base station antennas and power amplifiers
RF identification tags
Automotive radar and sensors
LNBs for direct broadcast satellites
Active devices and high power RF designs
8.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support